TEGO® Wärmeleitpaste Z is a silicone base with inorganic fillers.
Typical Applications
TEGO® Wärmeleitpaste Z is used for the assembly of diodes, transistors or thyristors to ensure the best possible heat transfer between semiconductors and radiating surfaces. It can also be applied for measuring surface temperatures.
Benefits at a glance
- Good heat conductivity
- Extreme temperature and oxidation stability
- Hydrophobic properties
- Excellent dielectric properties