ALBIFLEX® 297 is a bisphenol-A-epoxy-silicone block copolymer resin which is used to manufacture high-performance elastomers. ALBIFLEX® 297 is liquid at ambient temperature, epoxy reactive and cures with all aliphatic and cycloaliphatic epoxy resin curing agents. It can be processed by all conventional casting or molding techniques.
Typical Applications
ALBIFLEX® 297 is particularly well suited for use in elastic bonding, jointing and sealing compounds in electrical/electronics applications, for use as a binding agent in high-quality coating systems for printed circuit boards and as a base polymer for potting and casting compounds for electronic components. Along with excellent mechanical properties, ALBIFLEX® 297 provides outstanding compatibility with aromatic resins and hardeners.
Benefits at a glance
The specially designed block copolymer structure of ALBIFLEX® 297, made up of epoxy and silicone segments, provides an outstanding combination of properties
Upon curing ALBIFLEX® 297 forms a segmented molecular structure consisting of soft polysiloxane and rigid polyepoxy segments. The combination of polysiloxane and epoxy units in the polymer structure creates an elastomeric material combining the outstanding electrical and thermal properties of silicones with the high mechanical strength and the excellent adhesion of epoxy resins.
- High thermal shock resistance and temperature stability
- Glass transition temperature that is less reduced compared to other plasticizers
- Excellent elongation
- High mechanical stability
- Good adhesion on most substrates
- High hydrolysis stability
- Very low moisture absorption
- Lower water vapour permeability than silicones
Upon curing ALBIFLEX® 297 forms a segmented molecular structure consisting of soft polysiloxane and rigid polyepoxy segments. The combination of polysiloxane and epoxy units in the polymer structure creates an elastomeric material combining the outstanding electrical and thermal properties of silicones with the high mechanical strength and the excellent adhesion of epoxy resins.