TEGO® Surten 238 E is a good substrate wetting agent with very good solubility in aqueous systems and low foaming properties. It is a 100% active, easy to handle liquid that is especially suited for application in brittle material cutting, e.g. for high-speed multi-wire cutting systems.
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Typical Applications
TEGO® Surten 238 E provides a good reduction of the dynamic surface tension in combination with low foaming, making it suitable as additive in cutting fluids for brittle material cutting, e.g. photovoltaic silicon wafer slicing.
Benefits at a glance
- Dynamic surface tension reduction
- Higher process speed
- Higher wafer quality
- Low foam
- Enables wetting of low energy surfaces