NANOPOX® HP 120 is a high performance, versatile, silica reinforced epoxy resin based on a mixture of Bisphenol A and F for the use in electrical and electronic applications, adhesives and composites. The silica phase consists of surface-modified synthetic SiO2 nanospheres of very small size (average diameter of 20 nm) with a narrow particle size distribution (maximum diameter 50 nm). Despite the high SiO2 content of 40 wt%, NANOPOX® HP 120 has a comparatively low viscosity due to the agglomerate-free colloidal dispersion of the nanoparticles in the resin.
Typical Applications
NANOPOX® HP 120 is a versatile dispersion of colloidal silica in epoxy resins (DGEBA/F mixture, ratio 70:30) for the use various applications and markets. It enables highly filled, low viscosity formulations and improves mechanical properties, especially impact resistance. During impregnation process the nanoparticles penetrate into fiber bundles and stabilizes them. Therefore NANOPOX® HP 120 is frequently used in e.g. electronic adhesives e.g. underfills, fiber reinforced composites, automotive and aerospace applications.
Benefits at a glance
- Improvement on mechanical properties: Improved modulus and flexural strength, increase in toughness and compressive strength and significantly improved fatigue performance
- Low viscosity (especially when combined with conventional fillers)
- Low viscosity, thus suitable for injection processes
- Penetrates every filament (glas - , carbon, -basalt fibers, mica, ...)
- Suitable for underfill applications
- Improved surface quality, no fiber-printthrough (Class A)
- Improved scratch & abrasion resistance
- Lower CTE, reduced (cure) shrinkage
- Nanoparticles do not sedmentate and stabilize co-fillers
- Improves heat conductivity by preventing sedimentation of micro particles
- Enables extremely high loading levels in combination with suitable micron particles
- Good dielectrical properties: Low DK and Df
- No crystallization