NANOPOX® HP 130 is a high performance, versatile, silica reinforced cycloaliphatic epoxy resin for the use in electrical/electronic applications and adhesives. The silica phase consists of surface-modified synthetic SiO2 nanospheres of very small size (average diameter of 20 nm) with a narrow particle size distribution (maximum diameter 50 nm). Despite the high SiO2 content of 40 wt%, NANOPOX® HP 130 has a comparatively low viscosity due to the agglomerate-free colloidal dispersion of the nanoparticles in the resin.
Typical Applications
NANOPOX® HP 130 is a versatile dispersion of colloidal silica in cycloaliphatic epoxy resin (EEC) for the use in various applications and markets. NANOPOX® HP 130 enables the combination low viscosity with high filler loading levels. It improves mechanical properties and fatigue performance even at cryogenic temperatures. It is transparent. Furthermore, NANOPOX® HP 130 can be cured thermally or cationically. Therefore it is frequently used in e.g. optical clear adhesives, medical application, stereolithography, underfill adhesives and conformal coatings.
Benefits at a glance
- Improved modulus and flexural strength, increase in toughness and compressive strength
- Enables extremely high loading levels in combination with suitable micron particles
- Lower CTE, reduced shrinkage • Very low viscosity, thus suitable for injection and spray processes
- Improved surface quality, no fiber-printthrough (Class A)
- Suitable for underfill applications
- Nanoparticles do not sedmentate and stabilze co-fillers
- UV-curable