NANOPOX® HP 100 is a high performance, versatile, silica reinforced Bisphenol A based epoxy resin for the use in electrical and electronic, adhesives and composites. The silica phase consists of surface-modified synthetic SiO2 nanospheres of very small size (average diameter of 20 nm) with a narrow particle size distribution (maximum diameter 50 nm).
Despite the high SiO2 content of 40 wt%, NANOPOX® HP 100 has a comparatively low viscosity due to the agglomerate-free colloidal dispersion of the nanoparticles in the resin.
Typical Applications
NANOPOX® HP 100 is a versatile dispersion of colloidal silica in epoxy resin (DGEBA) for the use in various applications and markets. It enables highly filled, low viscosity formulations and improves mechanical properties, especially impact resistance. During impregnation process the nanoparticles penetrate into fiber bundles and stabilizes them. Therefore NANOPOX® HP 100 is frequently used in e.g. structural adhesives, fiber reinforced composites, automotive and aerospace applications, as well as hydrogen storage tanks.
Benefits at a glance
- Improvement on mechanical properties: fracture toughness, impact resistance and modulus
- Significantly improved fatigue performance
- Enables extremely high loading levels in combination with suitable micron particles
- Nanoparticles do not sedmentate and stabilze co-fillers
- Improves heat conductivity, by preventing sedimentation of micro particles during curing phase
- Lower CTE, reduced (cure) shrinkage
- Low viscosity (especially when combined with conventional fillers), thus suitable for injection processes
- Penetrates every fillament (glas - , carbon, -basalt fibers, mica, ...)
- Suitable for underfill applications
- Improved surface quality, no fiber-printthrough (Class A)
- Improved scratch & abrasion resistance
- Good dielectrical properties: Low DK and Df