TEGO® Surten 237 E is a nonfoaming dynamic wetting agent, especially suited for application in brittle material cutting, e.g. for high-speed multi-wire cutting systems.
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Typical Applications
TEGO® Surten 237 E provides a good balance between low dynamic surface tension and foam control, making it suitable as additive in cutting fluids for brittle material cutting, e.g. photovoltaic silicon wafer slicing.
Benefits at a glance
- Higher process speed
- Higher wafer quality
- Low foam