NANOPOX® HP 110 is a high performance, versatile, silica reinforced Bisphenol F based epoxy resin for the use in electrical and electronic applications, adhesives and composites. The silica phase consists of surface-modified synthetic SiO2 nanospheres of very small size (average diameter of 20 nm) with a narrow particle size distribution (maximum diameter 50 nm). Despite the high SiO2 content of 40 wt%, NANOPOX® HP 110 has a comparatively low viscosity due to the agglomerate-free colloidal dispersion of the nanoparticles in the resin.
Typical Applications
NANOPOX® HP 110 is a versatile dispersion of colloidal silica in epoxy resin (DGEBF) for the use in various applications and markets. It enables highly filled, low viscosity formulations and improves mechanical properties, especially impact resistance. During impregnation process the nanoparticles penetrate into fiber bundles and stabilizes them. Therefore NANOPOX® HP 110 is frequently used in e.g. electronic adhesives e.g. underfills, fiber reinforced composites, automotive and aerospace applications.
Benefits at a glance
- Low viscosity (especially when combined with conventional fillers)
- Low viscosity, thus suitable for injection processes
- Enables extremely high loading levels in combination with suitable micron particles
- Suitable for underfill applications
- Lower CTE, reduced (cure) shrinkage
- Improves heat conductivity, by preventing sedimentation of micro particles
- Nanoparticles do not sedmentate and stabilze co-fillers
- Improvement on mechanical properties: Improved modulus and flexural strength, increase in toughness and compressive strength
- Significantly improved fatigue performance
- Penetrates every filament (glas - , carbon, -basalt fibers, mica, ...)
- Improved scratch & abrasion resistance
- Improved surface quality, no fiber-printthrough (Class A)
- Good dielectrical properties: Low DK and Df