DEGACRYL® AC - Engineered for superior bonding in flat lamination
DEGACRYL® AC is Evonik’s family of bead‑type polyacrylates designed as main polymers in one‑component, moisture‑curable reactive hot melt (RHM) adhesives. Built primarily from methyl methacrylate (MMA) and n‑butyl methacrylate (n‑BMA), the product range offers tailored glass transition temperatures (Tg), molecular weights, and functionalities (acid and hydroxyl) to optimize performance in flat lamination processes and multilayer panel construction.
Why Choose DEGACRYL® AC?
By using DEGACRYL® AC polyacrylates inside the formulation of moisture curing hot melts, longer open times and higher initial strength are achieved. Additionally, their high molecular weight leads to excellent creep resistance of the adhesive, keeping bonded parts in place without the need for any further mechanical fixation.
Compared to pure polyester‑polyol RHMs, DEGACRYL® AC enables longer open times, higher initial strength, and significantly improved creep resistance, supporting fast production cycles with reliable in‑place bonding.
Open Time & Initial Strength:
Lab comparisons show that DEGACRYL® AC‑modified RHMs deliver long open times with shorter setting times and higher initial strength than pure polyester‑based RHMs - ideal for large panels and high‑throughput lines.
Creep Resistance:
The high molecular weight of DEGACRYL® AC grades contributes to excellent creep resistance, minimizing part movement and reducing the need for mechanical fixation during curing.
