AEROXIDE® Fumed Alumina serves a anti-settling agent in thermally conductive formulations
The Challenge
Thermally conductive formulations are based on material mixtures of a flowable and cross-linkable polymer matrix (silicone, polyurethane, epoxies, SMP, and acrylic-based others) and inorganic fillers that ensure thermal conductivity. These formulations are applied as thermal interface materials for efficient heat dissipation of electronic components e.g. in electrical vehicles.
A major drawback is the pronounced sedimentation of the filler particles in the uncured formulation. This leads to an undesirable inhomogeneity of the particle distribution and a deterioration of the thermal conductivity of the formulation due to the phase-separated material mixture.
