THE CHALLENGE: Meeting the latest technical requirements of the evolving electronics industry for semiconductors to realize new functionalities and better performance.
THE SOLUTION: Fumed silica and fumed metal oxides are used as abrasives for chemical mechanical polishing (CMP) in semiconductor process. Fumed oxides also serve as rheology controllers and reinforcing fillers in printed circuit board and 3D printing subjects. They are also used as sintering aid in multi-layer ceramic capacitors (MLCC) and engineering ceramics.
THE SMART EFFECT: AEROSIL® fumed silica, AEROXIDE® fumed metal oxides and AERODISP® dispersions enable perfectly flat chip surfaces and better mechanical and electrical properties of components. This improves the functionality of electronic devices.
