Heat is the silent performance killer. In electric vehicles, power electronics, and advanced sensors, efficient thermal management is critical for safety, reliability, and speed. Evonik develops and seNANOPOX® / NANOPOL®: Reduce cure shrinkage, enhance fatigue resistance, and enable high thermal conductivity.
Benefits:
- Stable viscosity at high filler loadings
- Controlled cure and pot-life for complex assembly
- Long-term durability under vibration and cycling
Power Electronics & Heatsink Assemblies
- SURFYNOL®: Improve wetting and reduce microfoam for uniform application.
Benefits:
Sensors & Semiconductor Packaging
Sustainability & Efficiency Built In
Your Evonik Advantage
Imagine a bond line that cures on schedule and keeps temperatures in check - charge after charge. Or a power device that stays cool under peak load thanks to a thermal paste engineered for endurance. That’s the Evonik advantage: fit-for-purpose chemistry, expert support, and solutions you can trust.
Ready to elevate your thermal management?
Explore our solutions for NANOPOL®, NANOPOX®, SURFYNOL®, TEGOPAC®, TEGO® Wärmeleitpaste Z.
Contact us to co-design your TIM formulation with the Crosslinker, Polymer, Modifier, and Inhibitor toolbox.
Learn more through Evonik’s technical resources and application guides.