Thermal Interface Materials

Enhance heat management performance across electronics, automotive systems, and battery technologies with our advanced thermal interface material solutions.

Heat is the silent performance killer. In electric vehicles, power electronics, and advanced sensors, efficient thermal management is critical for safety, reliability, and speed. Evonik develops and seNANOPOX® / NANOPOL®: Reduce cure shrinkage, enhance fatigue resistance, and enable high thermal conductivity. 

  • TEGOPAC®: Lower viscosity and improve cure-through in adhesive TIMs.

  • Crosslinker: Ensure strong, durable bonding for protective coatings and adhesive layers.
  • SURFYNOL®: Achieve void-free interfaces and consistent quality.

Benefits:

  • Stable viscosity at high filler loadings
  • Controlled cure and pot-life for complex assembly
  • Long-term durability under vibration and cycling

FormPower Electronics & Heatsink Assemblies

  • TEGO® Wärmeleitpaste Z: Ready-to-use silicone-based thermal paste with excellent heat conductivity and dielectric strength. 

  • Polymer / Modifier / Inhibitor: Configure silicone TIM gels and pastes with tailored rheology and predictable pot-life.

  • SURFYNOL®: Improve wetting and reduce microfoam for uniform application.

Benefits:

  • Reliable thermal contact and electrical insulation 
  • Customizable hardness and flow properties

  • Cleaner processing and long-term stability Form

Sensors & Semiconductor Packaging 

  • NANOPOL® / NANOPOX®: Improved thermal conductivity, viscosity and dimensional stability for encapsulants, pottings and coatings.

  • Crosslinker: Balance mechanical strength and chemical resistance in thin adhesive layers. 

  • SURFYNOL®: Improve wetting on low-energy substrates.

FormSustainability & Efficiency Built In

  • Energy Efficiency: Reduce heat losses and extend component life. 

  • Process Safety: Reactive diluents and inhibitors minimize emissions and improve EHS profiles.

  • Durability: Chemistries designed for long-term stability to reduce waste and maintenance. 

Your Evonik Advantage

Imagine a bond line that cures on schedule and keeps temperatures in check - charge after charge. Or a power device that stays cool under peak load thanks to a thermal paste engineered for endurance. That’s the Evonik advantage: fit-for-purpose chemistry, expert support, and solutions you can trust.

Ready to elevate your thermal management?

Explore our solutions for NANOPOL®, NANOPOX®, SURFYNOL®, TEGOPAC®, TEGO® Wärmeleitpaste Z.

Contact us to co-design your TIM formulation with the Crosslinker, Polymer, Modifier, and Inhibitor toolbox.

Learn more through Evonik’s technical resources and application guides. 

NANOPOL®

NANOPOX®

SURFYNOL®

TEGOPAC®