Printed Circuit Boards & Electronics Assembly

Elevate Electronics Performance with Evonik’s Smart Chemistry for Printed Circuit Boards, Copper Clad Laminates and Electronics Assembly

In a world driven by digital innovation, electronics must be smaller, faster, and more reliable - without compromising sustainability. From high-frequency signal transmission to long-term insulation and thermal stability, every layer of a printed circuit board matters. Evonik delivers advanced chemical solutions that empower formulators to build smarter electronics with more precision, better durability, and increased environmental responsibility.

Why Choose Evonik for your Printed Circuit Boards, Copper Clad Laminates & Electronics Assembly?

  • Proven Performance: Our trusted brands like POLYVEST®, PERTRONIC®, VISIOMER®, NANOPOL®, TEGOMER®, AEROSIL®, AEROXIDE®, AERODISP®, and more support critical functions across insulation, casting, etching, cleaning, dimensional stability (warping), dispersion and surface quality.

  • Sustainability at the Core: Bio-based monomers and clean processing agents enable low‑VOC, high‑performance electronics manufacturing, supported by energy‑efficient materials aligned with global sustainability standards.

  • Tailored Innovation: Our portfolio adapts to the evolving demands of miniaturization, signal integrity, and thermal management, enabling next‑generation PCB and semiconductor performance.

Solutions by Application

Electrical Insulation Resins

Modern electronics require insulation systems that deliver thermal stability, mechanical strength, and minimal dielectric loss. Evonik’s VISIOMER® Specialty Methacrylates are designed to meet these challenges.

  • VISIOMER® 1,4-BDDMA, VISIOMER® PEG 200 DMA, and VISIOMER® TRGDMA – Reactive diluents for unsaturated polyester (UP) and polyester imide (PEI) resins and crosslinkers to enable precise control over mechanical properties while contributing to thermally stable, high-performance systems.

  • VISIOMER® Terra PEG200 DMA – A bio-based alternative supporting sustainable formulation strategies without compromising performance.

These specialty methacrylates monomers replace conventional diluents like styrene and vinyl toluene, enabling low-VOC, high-performance insulation resins for next-generation electronics.

Casting Resins & Potting Compounds

  • POLYVEST® – Reactive polybutadienes that enhance elasticity, thermal stability, and long-term durability in casting and potting applications. Ideal for protecting sensitive components from moisture, vibration, and thermal cycling.

Nano Silica Concentrates

  • NANOPOL® – Nano silica concentrates that improve mechanical strength, thermal conductivity and dimensional stability in epoxy-based systems. Essential for miniaturized electronics and high-performance PCBs and copper clad laminates. 

Advanced Silica for PCB & Electronics Performance

  • AEROSIL®, AEROXIDE®, and AERODISP® as key enablers for HDI boards, advanced packaging, and next‑generation laminate technologies, deliver silica‑based Smart Effects that enhance:

  • Rheology control for consistent processing and reduced defects

  • Reinforcement for mechanical stability and warpage reduction

  • Dielectric performance for high‑frequency signal integrity

  • Surface quality for reliable metallization, etching, and adhesion

Surface Treatment & Etching

  • Ammonium Persulfate & Sodium Persulfate – High-purity oxidizing agents used in PCB cleaning, micro-etching, and surface preparation. These materials ensure clean, precise, and reliable circuit paths.

  • DRIVOSOL® – Propellants for electronics cleaning and processing, supporting safe and efficient application in controlled environments.

  • PERTRONIC® - High-purity hydrogen peroxide acts as an oxidizing agent in copper and tungsten CMP processes and in selective metal etching applications. Also used in cleaning and surface conditioning in 2.5D and 3D packaging applications, and as an etchant in the production of printed circuit boards. PERTRONIC® contributes to manufacturing advanced flat panel displays, such as in  photoresist removal and wet cleaning.

Dispersion & Processing Aids

  • TEGOMER® – Additives that improve dispersion, flow, and compatibility in resin systems. They enhance processing efficiency and final product quality in electronics manufacturing.

Your Evonik Advantage

  • High Purity & Reliability: Engineered for precision-critical applications in electronics and PCB manufacturing.

  • Eco-Conscious Chemistry: Reduce emissions and meet global sustainability standards.

  • Expert Collaboration: Our technical teams work closely with you to optimize formulations and scale production.

Ready to Build the Future of Electronics?

Discover how Evonik’s advanced materials can help you design smarter, safer, and more sustainable electronics—from the inside out.

Contact us today or explore our solutions to start your journey toward high-performance electronics assembly.

 

VISIOMER®

AEROSIL®

NANOPOL®

POLYVEST®

TEGOMER®

AERODISP®

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