In a world driven by digital innovation, electronics must be smaller, faster, and more reliable. From high-frequency signal transmission to long-term insulation and thermal stability, every layer of a printed circuit board matters. Evonik delivers advanced chemical solutions that empower formulators to build smarter electronics with more precision, better durability, and access to ISCC PLUS mass-balanced raw material options.
Why Choose Evonik for your Printed Circuit Boards, Copper Clad Laminates & Electronics Assembly?
- Proven Performance: Our brands including POLYVEST®, PERTRONIC®, VISIOMER®, NANOPOL®, TEGOMER®, AEROSIL®, AEROXIDE®, AERODISP®, and more support critical functions across insulation, casting, etching, cleaning, dimensional stability (warping), dispersion and surface quality.
- Bio-Based and Mass-Balanced Options: POLYVEST® eCO grades are ISCC PLUS certified under the mass balance approach and can be used as drop-in replacements for standard grades — no requalification, no reformulation, unchanged physicochemical properties.
- Tailored Innovation: Our portfolio adapts to the evolving demands of miniaturization, signal integrity, and thermal management supporting PCB and semiconductor performance requirements.
Solutions by Application
Electrical Insulation Resins
Modern electronics require insulation systems that deliver thermal stability, mechanical strength, and minimal dielectric loss. Evonik’s VISIOMER® Specialty Methacrylates are designed to meet these challenges.
- VISIOMER® 1,4-BDDMA, VISIOMER® PEG 200 DMA, and VISIOMER® TRGDMA – Reactive diluents for unsaturated polyester (UP) and polyester imide (PEI) resins and crosslinkers to enable precise control over mechanical properties while contributing to thermally stable, high-performance systems.
These specialty methacrylates monomers can replace conventional diluents like styrene and vinyl toluene, supporting lower-VOC insulation resin formulations. Actual VOC levels depend on the complete formulation.
Casting Resins & Potting Compounds
POLYVEST® – Reactive polybutadienes that enhance elasticity, thermal stability, and long-term durability in casting and potting applications. Suitable for formulations protecting sensitive components from moisture, vibration, and thermal cycling.
NANOPOL® and Advanced Silica
- NANOPOL® – Nano silica concentrates that improve mechanical strength, thermal conductivity and dimensional stability in epoxy-based systems. Essential for miniaturized electronics and high-performance PCBs and copper clad laminates.
- AEROSIL®, AEROXIDE®, and AERODISP® as key enablers for HDI boards, advanced packaging, and next-generation laminate technologies, deliver silica-based Smart Effects that enhance: Rheology control / Reinforcement / Dielectric performance / Surface quality
Surface Treatment & Etching
- Ammonium Persulfate & Sodium Persulfate – High-purity oxidizing agents used in PCB cleaning, micro-etching, and surface preparation. These materials support clean, precise, and reliable circuit paths.
- PERTRONIC® - High-purity hydrogen peroxide acts as an oxidizing agent in copper and tungsten CMP processes and in selective metal etching applications. Also used in cleaning and surface conditioning in 2.5D and 3D packaging applications, and as an etchant in the production of printed circuit boards. PERTRONIC® contributes to manufacturing advanced flat panel displays, such as in photoresist removal and wet cleaning.
Dispersion & Processing Aids
TEGOMER® – Additives that improve dispersion, flow, and compatibility in coating and dispersion formulations used in electronics manufacturing. They enhance processing efficiency and final product quality.
Your Evonik Advantage
- High Purity & Reliability: Engineered for precision-critical applications in electronics and PCB manufacturing.
- Certified Mass-Balanced Options: POLYVEST® eCO grades are ISCC PLUS certified, with full traceability of the sustainable raw materials used in production.
- Expert Collaboration: Our technical teams work closely with you to optimize formulations and scale production.
Ready to Build the Future of Electronics?
Discover how Evonik’s advanced materials can help you design high-performance electronics with ISCC PLUS mass-balanced material options.
Contact us today or explore our solutions to start your journey toward high-performance electronics assembly.